Electronic components, semiconductors, and ICs (integrated circuits)

The MicroThin Series features 1.5–5 μm ultra-thin copper foil supported by a carrier foil. It is designed for high-density, fine-line circuitry formation in advanced electronic applications

High-performance materials for embedded capacitors, supporting improved electrical performance and higher circuit integration.

Advanced crystalize grain structure control technology delivers outstanding flexibility and durability, maintaining excellent performance even after repeated bending.

Advanced smooth surface treatment technology minimizes transmission loss in high-frequency signal applications to the greatest extent possible.

Mitsui Kinzoku's negative combines high contraction efficiency, flexible customization options, and a wide operating temperature range, delivering optimal performance across a broad range of applications.

This is a fine powder of an alloy made from a base of tin with added silver, copper, bismuth, and other elements. It is the most common bonding material used to join electronic components electrically and mechanically.

Copper powder has excellent electrical and thermal conductivity and is one of the materials that underpin a wide range of industries, including those that use electronic materials and metallurgical powders.

Our division's metal products are used in a wide range of industrial sectors, including magnetic materials and hydrogen storage materials.

We offer a wide range of rare earth oxides and rare earth compounds.

We provide various products such as rare earth salts and fluorides, which are widely used in the fields of ceramics and electronic materials.

Tantalum oxide/tantalum niobium carbide is a compound with a high melting point and corrosion resistance. We purify it to high purity by solvent extraction and supply it for electronic ceramics, cemented carbide tools, and optical lenses.

Cerium oxide-based abrasives are used for polishing glass for LCD panels and hard disks.

Substrate abrasives for SiC wafers are high-performance polishing materials that can smooth SiC surfaces down to the atomic level in a short time.

This is a zirconia-based fine Ceramics with high strength and high toughness. It offers excellent heat resistance and corrosion resistance, and performs well in high-temperature and corrosive environments.

This refractory material has high refractoriness and chemical resistance. This highly corrosion-resistant material maintains its shape and strength even under harsh conditions, making it suitable for use in the sintering of electronic materials.

This is a refractory material with a mullite crystal structure. It features high refractoriness and thermal shock resistance, and is lightweight, strong, and suitable for a wide range of applications.

This is a widely used, well-balanced alumina-based fine Ceramics . It offers excellent mechanical, thermal, and electrical properties, as well as cost-effectiveness and high-temperature stability.

This refractory material is made by adding a special binder to alumina raw material and firing it at high temperatures. It features high purity, high refractoriness, and high-temperature stability, and offers a wide range of properties.

This is a fine- Ceramics , which offers excellent thermal shock resistance and high-temperature strength. It has low thermal expansion and offers corrosion resistance and electrical insulation, making it suitable for high-load applications.

This is a high-precision, high-resolution 3D printing solution that combines 3D printing technology with the unique Ceramics sintering technology developed by Mitsui Kinzoku .

This is a high-purity silicon carbide fine powder Ceramics with excellent strength and wear resistance. It exhibits minimal loss of strength even at high temperatures, making it suitable for harsh environments.

This is unpressurized sintered silicon carbide ( Ceramics ). This material is superior to other SiC materials for high-temperature applications and offers both corrosion resistance and thermal shock resistance.

A composite material consisting of silicon carbide with metallic silicon offers excellent airtightness, high-temperature strength, oxidation resistance, and thermal conductivity for harsh environment.

We provide oxide semiconductor targets, with a focus on high-performance IGZO targets.

Our proprietary technologies achieve high density and provide high-quality ITO targets with reduced nodule formation.

We manufacture and customize metal, oxide, nitride, and compound sputtering targets, including Cu, Al, Ti, Mo, In₂O₃, ZnO, SnO₂, AZO, TCO, SiN, and AlN, and propose optimal materials for displays, semiconductors, solar cells, and other PVD applications.

A next-generation ITO target that suppresses particle generation and helps stabilize the deposition process.

High-quality targets ideal for cylindrical sputtering systems that enable high-efficiency, uniform deposition.

It is a solution raw material for tantalum, niobium, and other difficult-to-solve elements. It has excellent handling properties and is useful in various applications such as catalysts, film deposition, and sol-gel.

Liquid raw materials in which various metal compounds are dissolved. Unlike dispersions, no particulates are present.