Summary
The ability to stably suppress thermal expansion across a wide temperature range
Negative thermal expansion materials contract as the temperature rises; adding them to resins, metals, glass, and other materials makes it possible to suppress thermal expansion and adjust the coefficient of thermal expansion.
It is expected to find applications in various industrial fields, including semiconductors and sensors.
In particular, in AI data centers, as heat generation increases and semiconductor packages become larger, issues such as warping caused by differences in thermal expansion between dissimilar materials are becoming more apparent, making ensuring reliability an urgent priority.
Against the backdrop of these structural challenges, negative thermal expansion materials are expected to see medium- to long-term growth as one of the promising growth areas in the thermal management market.
By using a negative thermal expansion material instead of a silica filler, it is possible to control thermal expansion more effectively.
Features and Strengths
-
High contraction effect
Our negative thermal expansion material offers world-class contraction performance at the practical level. This helps improve design flexibility in thermal expansion control and ensures long-term reliability.
-
Customizable specifications
We offer customization options tailored to specific applications and required characteristics, including surface treatment, spheronization, particle size control, and compatibility with low-dielectric-constant grades. We deliver optimal performance designs tailored to the specifications of the final product.
-
Wide temperature range
Our negative thermal expansion materials are capable of withstanding a wide range of temperatures, from low to high. You can select the optimal grade based on the temperature range in which you wish to minimize thermal expansion.
Examples of Uses
・Semiconductor Packaging
・Copper-clad laminate
・Special-purpose engineering plastics
・Sensor
Line-up
Our negative thermal expansion material offers world-class contraction performance at the practical level. This helps improve design flexibility in thermal expansion control and ensures long-term reliability.
We offer customization options tailored to specific applications and required characteristics, including surface treatment, spheronization, particle size control, and compatibility with low-dielectric-constant grades. We deliver optimal performance designs tailored to the specifications of the final product.
It is also capable of operating across a wide temperature range, from low to high temperatures. You can select the optimal grade based on the temperature range in which you wish to minimize thermal expansion.
| Temperature range | Low | Low~Middle | Middle~High | |
|---|---|---|---|---|
| Substance | ZMP | CZVPO | ZSP | |
| Maximum linear expansion coefficient*1 | −66 ppm/K | −12 ppm/K | −38 ppm/K | |
| Features | Excellent at near-room temperature Contraction Performance |
Consistent across a wide temperature range Contraction Performance |
The best in the high-temperature range Contraction Performance |
|
| Shrinkage Temperature Range (): The temperature range in which shrinkage is particularly effective | °C | −10°C to 80°C (40) | -170°C to 230°C (–170 to 230) |
100°C–500°C (180) |
| Average Particle Size (D50) | μm | 4~5 | 2~10 | 0.6 |
| Bulk density | g/cm3 | 1 | 1 | 0.1 |
| True Density | g/cm3 | 3.7 | 3.9 | 2.9 |
| Dielectric constant*2 | - | 4.8 | 4.9 | 5.8 |
| Dielectric loss tangent*2 | - | 0.010 | 0.006 | 0.031 |
| Heat Resistance (Thermal Decomposition Temperature)*3 | °C | 900 | 650 | 800 |
ZMP, CZVPO: Invented by Professor Takenaka (Nagoya University)
ZSP: Invented by Professor Isobe (Tokyo University of Science)
*1 Coefficient of linear expansion *2 Cavity resonator JIS C2565 (10 GHz) *3 In air
Please feel free to contact us regarding product case studies, technical consultations, and more.
