
Summary
Balancing Printability and Performance
Due to its high reflectivity and high thermal conductivity, copper is generally considered a difficult material to print using L-PBF (laser powder bed fusion).
On the other hand, our copper-chromium alloy powder can achieve high densification even when processed on a standard L-PBF system (400 W laser power), resulting in extremely high thermal and electrical conductivity.
Furthermore, since we can provide our standard printing parameters, this reduces the time required to evaluate printing conditions and helps lower printing development costs.
Features and Strengths
-
High thermal conductivity
-
Excellent fine-feature printability
-
High printing productivity
Examples of Uses
・Thermal management applications (e.g., cold plates for AI servers)
・Rocket Chamber
・Induction coil
・EV-related components
Line-up
Thermal Management Applications
In addition to high thermal conductivity, copper-chromium alloys exhibit superior mechanical properties compared to other materials. As a result, this makes it possible to increase the surface area of thermal management components—such as cold plates—through the use of microchannels and other features, thereby contributing to improved heat exchange performance (heat dissipation characteristics).
Comparison Table of Material Properties of printed Parts
| Material | Company | Laser Output | Relative Density | Conductivity | Resolution | |
|---|---|---|---|---|---|---|
| Thermal Conductivity | Electrical Conductivity | Minimal Wall thickness | ||||
| W | % | W/mK | % IACS | μm | ||
| CuCr MA-CCR25L |
Mitsui Kinzoku | 400 | 99.5 | 377 | 95 | 200*2* |
| CuCr MA-CCR25H |
Mitsui Kinzoku | 400 | 99.5 | 349 | 93 | below 150*2* |
| CuCrZr | EOS*1 | 1000 | 99 | - | 80-85 | - |
| Sandvik*1* | - | 98 | 324 | 80-90 | - | |
| Pure Copper | EOS*1* | 400 | 95 | - | 90 | - |
| EOS*1* | 1000 | 99.6 | - | 100.7 | 700 | |
*1 Each company's website
*2 Mitsui's internal test results using the EOS M290
Next Next
Aerospace Applications
Copper-chromium alloys contribute to their use in aerospace components because, compared to other materials, they combine high thermal conductivity with excellent mechanical properties and manufacturing productivity.
Comparison Table of Material Properties of printed Parts
| Material | Post Heating | Performance of Printed Parts | Manufacturing Cost Related Factors | |||||
|---|---|---|---|---|---|---|---|---|
| Tensile Strength at R.T. /MPa | Tensile Strength at 400°C/MPa | Thermal Conductivity W/mK | Material Cost | Printing Productivity cc/h | ||||
| Vertical | Horizontal | Vertical | Horizontal | |||||
| CuCr MA-CCR25H |
Anneal at 600°C | 404 | 482 | 187 | 222 | 298 | $ Inexpensive |
✓✓ High |
| Anneal at 650°C | 356 | 393 | 169 | 178 | 330 | |||
| Anneal at 700°C | 282 | 344 | 139 | 150 | 343 | |||
| GRCop-42 | HIP | 355*1* | 180*1* | 270*1* | $$$ Expensive |
✓✓ High |
||
| HIP at 954°C | 389*2* | - | 323*2* | |||||
| CuCrZr | Anneal at 950°C, water quench, age at 600°C | 295*3* | 340*3* | - | 324*4* | $ Inexpensive |
✓ Low |
|
*1 NASA
*2 Velo3D
*3 Nikon SLM Solutions
*4 Sandvik
Other Line-up
In addition to copper-chromium alloy powders, we also offer high-purity copper powders that have been specifically formulated for 3D printing processes.
| Material | Material Name | AM Process | Particle Size (μm) * | Advantage | Example Applications | ||||
|---|---|---|---|---|---|---|---|---|---|
| D10 | D50 | D90 | Cold Plate | Induction Coil | Aerospace | ||||
| CuCr | MA-CCR25L | L-PBF | 13 | 30 | 51 | High Conductivity High Resolution Consistent Quality |
✓✓ | ✓ | |
| CuCr | MA-CCR25H | L-PBF | 17 | 32 | 53 | High Strength High Resolution Consistent Quality |
✓✓ | ✓ | ✓ |
| Cu | MA-HC-LOP | L-PBF, Cold Spray |
16 | 28 | 45 | High Purity Consistent Quality |
✓ | ✓ | |
| Cu | MA-HC-3 | Binder Jetting, DLP |
6 | 15 | 26 | ✓ | |||
*These numbers are examples of measurements and do not specify the characteristics of the powder.
✓✓: Highly recommended
✓: Recommend
Please feel free to contact us regarding product case studies, technical consultations, and more.


