Mitsui Kinzoku As a leading company in the non-ferrous metals industry, we manufacture products using the gas atomization process
We offer highly conductive copper powder (copper-chromium alloy powder) for 3D printers.
Complex shapes for the aerospace industry and
Realizing High-Thermal-Conductivity Components in a Short Time
Copper-chromium alloy powder (CuCr) has tensile strength and thermal conductivity equivalent to or greater than those of GRCop₋42 and CuCrZr. After printing with a 3D printer, you can freely adjust the properties of the printed object by adjusting the annealing temperature during post-processing. Furthermore, because material costs are low and the printing speed is fast, it is possible to keep the manufacturing costs of parts down.
Comparison Table of Material Properties for Aerospace Applications
| Material | Post Heating | Performance of Printed Parts | Manufacturing Cost Related Factors | |||||
|---|---|---|---|---|---|---|---|---|
| Tensile Strength at R.T. /MPa |
Tensile Strength at 400°C/MPa |
Thermal Conductivity W/mK |
Material Cost |
Printing Productivity cc/h |
||||
| Vertical | Horizontal | Vertical | Horizontal | |||||
|
CuCr MA-CCR25H |
Anneal at 600°C | 404 | 482 | 187 | 222 | 298 |
$ Inexpensive |
✓✓ High |
| Anneal at 650°C | 356 | 393 | 169 | 178 | 330 | |||
| Anneal at 700°C | 282 | 344 | 139 | 150 | 343 | |||
| GRCop-42 | HIP | 355*1* | 180*1* | 270*1* | $$$ Expensive |
✓✓ High |
||
| HIP at 954°C | 389*2* | - | 323*2* | |||||
| CuCrZr | Anneal at 950°C, water quenching, aging at 600°C |
295*3* | 340*3* | - | - | 324*4* | $ Inexpensive |
✓ Low |
*1 NASA
*2 Velo3D
*3 Nikon SLM Solutions
*4 Sandvik
3D printing improves the efficiency of heat exchangers
Achieves high thermal conductivity
Copper-chromium alloy powder (CuCr) offers excellent fine-scale manufacturing capabilities in 3D printing and exhibits high electrical and thermal conductivity.
It is now possible to easily design and manufacture complex-shaped thermal applications with optimized heat exchange with fluids—something that was difficult to achieve using conventional methods.
Thermal Management Applications: Comparison Table of Material Properties for Printed Objects
| Material | Company | Laser Output | Relative Density | Conductivity | Resolution | |
|---|---|---|---|---|---|---|
| Thermal Conductivity |
Electrical Conductivity |
Minimal Wall thickness |
||||
| W | % | W/mK | % IACS | μm | ||
| CuCr MA-CCR25L |
Mitsui Kinzoku | 400 | 99.5 | 377 | 95 | 200*2 |
| CuCr MA-CCR25H |
Mitsui Kinzoku | 400 | 99.5 | 349 | 93 | below 150*2 |
| CuCrZr | EOS*1* | 1000 | 99 | - | 80-85 | - |
| Sandvik*1* | - | 98 | 324 | 80-90 | - | |
| Pure Copper | EOS*1* | 400 | 95 | - | 90 | - |
| EOS*1* | 1000 | 99.6 | - | 100.7 | 700 | |
*1 Each company’s website
*2 Mitsui’s internal test results using the EOS M290
Mitsui Kinzoku Examples of Objects Created Using High-Conductivity Copper Powder
Heat Exchanger
It allows for the easy fabrication of fine and complex structures.
Cold Plates for Data Centers
This technology enables the creation of structures with optimized heat transfer to fluids—something that could not be achieved using existing manufacturing methods.
Performance of Cold Plates for Data Centers
Thanks to a design optimized for 3D printing, pressure loss can be reduced by 90% and thermal resistance by more than 20%.
High-Conductivity Copper Powder for Metal 3D Printers Line-up
This is spherical copper powder produced using the gas atomization method. We offer grades tailored to various modeling techniques.
Please contact us for more details.
| Material | Material Name |
AM
Process |
Particle Size (µm) * |
Advantage | Example Applications | ||||
|---|---|---|---|---|---|---|---|---|---|
|
D10 |
D50 | D90 |
Cold Plate |
Induction Coil |
Aerospace |
||||
|
CuCr |
MA-CCR25L |
L-PBF |
13 | 30 | 51 | High Conductivity High Resolution Consistent Quality |
✓✓ |
✓ | |
|
CuCr |
MA-CCR25H |
L-PBF |
17 | 32 | 53 | High Strength High Resolution Consistent Quality |
✓✓ |
✓ | ✓ |
| Cu | MA-HC-LOP | L-PBF, Cold Spray |
16 | 28 | 45 |
High Purity |
✓ | ✓ | |
| Cu | MA-HC-3 |
Binder Jetting, |
6 | 15 | 26 | ✓ | |||
*These numbers are examples of measurements and do not specify the characteristics of the powder.
✓✓: Highly recommended
✓: Recommend