Summary
Uniform particle size distribution with a particle size of 150 nm
Low-temperature sinterable copper powder is a functional powder used to sinter fine copper particles at relatively low temperatures to form joints and wiring with high electrical and thermal conductivity. This low-temperature sinterable copper powder is characterized by a uniform particle size distribution with a particle size of 150 nm, which enables sintering at a low temperature of 190°C in a short processing time. By leveraging this excellent low-temperature sintering performance, it is expected to be used as a sintering filler in high-density packaging applications such as semiconductor junctions and fine wiring.
Features and Strengths
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Copper powder with a particle size of 150 nm and uniform particle size distribution
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Low-temperature, short-time sintering at 190°C
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Sintering Filler for Semiconductor Junctions
Applications
・Die-bonding materials
・Wiring Materials
・Electrode materials
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