Solder Powder
Engineered Powders Division

Solder Powder

This is a fine powder of an alloy made from a base of tin with added silver, copper, bismuth, and other elements. It is the most common bonding material used to join electronic components electrically and mechanically.

Summary

Achieving the appropriate composition and particle size for each application

We provide powders with a uniform particle size that are easy to use in applications such as conductive adhesives.

Features and Strengths

  1. Various Compositions and Particle Sizes

  2. Customization Options Tailored to Your Needs

Examples of Uses

・Electrical and physical bonding of electronic components
・Electrical Wiring Connections
・Joining Metals Together

Line-up

We offer a variety of compositions and particle sizes at Line-up. We accept requests for prototypes of various materials, so please feel free to contact us.

Prototype Examples:
Sn-Ag, Sn-Bi-Ag, Sn-Ag-Bi-In, Sn-Sb, 5-component systems, 6-component systems, etc.

Materials and Composition Particle size
Sn96.5-Ag3.0-Cu0.5(SAC305)
Sn42.0-Bi58.0
25–45 (Type 3)
20–38 (Type 4)
10–25 (Type 5)
DS10
Sn96.5-Ag3.0-Cu0.5(SAC305)
Sn42.0-Bi58.0
Sn72.0-Bi28.0
Sn100
ST-7
STC-7(Type6)
ST-5
STC-5
ST-3
STC-3(Type7)
You can scroll

Particle Size Distribution

Solder Powder For those who want to learn more about this

Please feel free to contact us regarding product case studies, technical consultations, and more.

Inquiries about Engineered Powders Products
Inquiries about Engineered Powders Products

For questions or consultations about Engineered Powders products, please feel free to contact us via the form below.

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