Summary
Achieving Consistent Electrical Conductivity Through Proven Coating Technology
Mitsui Kinzoku using the latest technology and extensive expertise, we have achieved a uniform silver coating on the powder surface, resulting in stable electrical conductivity. By selecting the core material, we can provide powders tailored to your specific requirements, such as particle size, particle shape, dispersibility, coating efficiency, and conductivity.
Features and Strengths
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High level of customization
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Meets a Wide Range of Requirements
Examples of Uses
・Thick-film conductive paste (sintered type/resin-cured type)
・Shielding material
・Conductive adhesive
Line-up
① Dendritic powder: Due to its dendritic shape, this powder can form conductive pathways even at low concentrations.
② Spherical powder: The silver content can be adjusted as desired.
③ Flaked powder: The silver content can be adjusted as desired.
| Variety | Specific Surface Area (m²/g) | Particle Size Distribution (μm) | Tap Density (g/cm³) | Ag(wt%) | ||
|---|---|---|---|---|---|---|
| D10 | D50 | D90 | ||||
| ACAX-225 (10% Ag, dendritic powder) |
0.47 | 4.1 | 11.2 | 23.7 | 1.6 | 10 |
| ACBY-2 (10% Ag, dendritic powder) |
0.85 | 2.2 | 6.4 | 14.7 | 1.2 | 10 |
| ACPZ-2 (10% Ag, spherical powder) |
0.50 | 1.0 | 2.2 | 4.0 | 4.9 | 10 |
| ACFY-2 (10% Ag, spherical powder) |
0.29 | 3.6 | 5.4 | 8.4 | 4.8 | 10 |
*These are representative physical properties; various types of copper powder can be silver-coated.
Please feel free to contact us regarding product case studies, technical consultations, and more.
