
summary
High performance polishing slurry for SiC wafers NANOBIX™.
Since silicon carbide (SiC) single crystal is receiving attention as a material for many power devices. However, it is extremely hard and requires considerable skill and time to smoothen the surface down to the atom level.
We have succeeded in developing an abrasive that can quickly smoothen silicon carbide to utilize our time-proven technology for developing abrasives.
Features and Strengths
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MnO₂ abrasive grains enable high-speed and low-damage machining in a single process
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Possible to process C and Si surfaces with less rate difference
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Easy equipment cleaning/wafer cleaning
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Available in circulation
Examples of Uses
For SiC wafers
Two-component polishing slurry
Please feel free to contact us for product case studies and technical consultation.