summary
Cerium oxide-based abrasive MIREK™.
This abrasive is based on cerium oxide, and it is used in advanced field of the electronic and optical industry to polish glass substrate, hard disk, photomask, and optical glass.
Features and Strengths
-
CeO₂ abrasive grains enable high-rate, low-damage processing
-
Abundant lineup suitable for each application, from primary polishing to final finishing
-
Customization is possible by using various additives to suit the customer's usage.
Examples of Uses
Liquid crystal glass substrate
Hard disk board
Photomask
Optical glass
(product) line-up
|
(taxonomical) form |
characteristics |
Average particle diameter (μm) |
Main applications |
|---|---|---|---|
|
HL05 |
fine powder |
0.5~0.9 |
For final finishing |
|
HL10 |
0.8~1.3 |
For final finishing |
|
|
HL21 |
1.0~1.4 |
For final finishing |
|
|
HL30 |
1.2~1.7 |
For primary polishing |
|
|
HL40 |
1.5~2.3 |
For primary polishing |
|
|
HL030CS |
slurry |
0.2~0.3 |
For final finishing |
|
HL020CS |
0.1~0.2 |
For final finishing |
|
|
K020C |
0.08~0.15 |
For final finishing |
The above data are representative values, not standard values.
Please feel free to contact us for product case studies and technical consultation.
