Metal Processing and Manufacturing Industry

The MicroThin Series features 1.5–5 μm ultra-thin copper foil supported by a carrier foil. It is designed for high-density, fine-line circuitry formation in advanced electronic applications

High-performance materials for embedded capacitors, supporting improved electrical performance and higher circuit integration.

Advanced crystalize grain structure control technology delivers outstanding flexibility and durability, maintaining excellent performance even after repeated bending.

Advanced smooth surface treatment technology minimizes transmission loss in high-frequency signal applications to the greatest extent possible.

Our division's metal products are used in a wide range of industrial sectors, including magnetic materials and hydrogen storage materials.

We offer a wide range of rare earth oxides and rare earth compounds.

We provide various products such as rare earth salts and fluorides, which are widely used in the fields of ceramics and electronic materials.

Tantalum oxide/tantalum niobium carbide is a compound with a high melting point and corrosion resistance. We purify it to high purity by solvent extraction and supply it for electronic ceramics, cemented carbide tools, and optical lenses.

Cerium oxide-based abrasives are used for polishing glass for LCD panels and hard disks.

Substrate abrasives for SiC wafers are high-performance polishing materials that can smooth SiC surfaces down to the atomic level in a short time.

This is a high-precision, high-resolution 3D printing solution that combines 3D printing technology with the unique Ceramics sintering technology developed by Mitsui Kinzoku .

It is a solution raw material for tantalum, niobium, and other difficult-to-solve elements. It has excellent handling properties and is useful in various applications such as catalysts, film deposition, and sol-gel.