summary
Exceptional Flexibility for Continuous Bending
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Product Images: Electro-deposited copper foil for flexible printed circuit boards
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Copper foil cross section
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MIT test with copper foil adapted to FPC
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Flexible printed circuit boards are widely used in smartphones, wearable devices, and other compact electronic products that require exceptional flexibility and durability. Our electro-deposited copper foil incorporates advanced crystalize grain structure control technology, designed to reduce crack formation by minimizing grain boundaries. This innovative structure delivers outstanding flex resistance, enhanced durability, and long-term reliability even in applications subjected to continuous and repeated bending.
Features and Strengths
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Advanced Crystalize Grain Structure Control
Applications
Flexible printed circuit boards (FPCBs)
Product-Line Up
![Lineup table of electro-deposited copper foil for flexible printed circuit boards (FPC). Profile type, Model No., Surface roughness Lam. Side [μm], Cross-sectional image, and Thickness [μm] are listed. Very Low Profile (3EC-M2S-HTE SP2): Surface roughness Rz1.4, thickness 12μm. Super Low Profile (3EC-M2S-HTE SP3): Surface roughness Rz 0.9 sim 1.1 Thickness 9, 12, 18, 35μm](https://em.mitsui-kinzoku.com/copper-foil/uploads/cf020ec5a9297290a9f44e2697ebfc379226e0f5.png)
Our electrodeposited copper foil is designed for a wide range of flexible printed circuit board applications.
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