summary
Optimized response to the skin effect, enabling high-speed communication performance
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Product Images: VSP™.
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General copper foil surface
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Surface of VSP™.
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Mango placed on electrolytic copper foil for high-speed signals. High reflective performance due to smooth surface
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Electro-deposited copper foil for high-speed signaling enables stable transmission of high-frequency signals in today’s data-driven world, where transmission volumes continue to grow rapidly. At high frequencies, signals inherently exhibit a pronounced “skin effect,” in which current is concentrated near the surface of the conductor. As frequency increases, this effect becomes more significant, causing current to flow through an increasingly shallow surface layer, making signal performance more sensitive to surface roughness. The VSP™ Series features an ultra-smooth copper foil surface achieved through advanced deposition technology and precise process control. This optimized surface profile helps reduce signal loss and enhance transmission performance, making it an ideal choice for high-frequency printed circuit board applications. Trusted for its superior signal integrity and reliability, the VSP™ Series is widely used in telecommunications infrastructure, data center equipment, high-performance servers, and other next-generation networking applications.
Features and Strengths
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Precise control of Nodulation shape enables superior surface smoothness and uniformity, supporting stable high-frequency signal transmission.
Applications
Ideal for forming circuit patterns in high-speed transmission printed circuit boards used in network equipment and related applications.
Characteristics (Lineup)
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