Electronics and Information & Communications Industry

The MicroThin Series features 1.5–5 μm ultra-thin copper foil supported by a carrier foil. It is designed for high-density, fine-line circuitry formation in advanced electronic applications

High-performance materials for embedded capacitors, supporting improved electrical performance and higher circuit integration.

Advanced crystalize grain structure control technology delivers outstanding flexibility and durability, maintaining excellent performance even after repeated bending.

Advanced smooth surface treatment technology minimizes transmission loss in high-frequency signal applications to the greatest extent possible.

With excellent weather and heat resistance, it enables near-infrared sensing regardless of location or environment.

Mitsui Kinzoku's negative combines high contraction efficiency, flexible customization options, and a wide operating temperature range, delivering optimal performance across a broad range of applications.

Although oxides are generally insulators, they can become conductive when small amounts of other elements are added. It is primarily used in transparent conductive films and electronic devices.

This is a fine powder of an alloy made from a base of tin with added silver, copper, bismuth, and other elements. It is the most common bonding material used to join electronic components electrically and mechanically.

Copper powder has excellent electrical and thermal conductivity and is one of the materials that underpin a wide range of industries, including those that use electronic materials and metallurgical powders.

Our division's metal products are used in a wide range of industrial sectors, including magnetic materials and hydrogen storage materials.

We offer a wide range of rare earth oxides and rare earth compounds.

We provide various products such as rare earth salts and fluorides, which are widely used in the fields of ceramics and electronic materials.

Tantalum oxide/tantalum niobium carbide is a compound with a high melting point and corrosion resistance. We purify it to high purity by solvent extraction and supply it for electronic ceramics, cemented carbide tools, and optical lenses.

Cerium oxide-based abrasives are used for polishing glass for LCD panels and hard disks.

Substrate abrasives for SiC wafers are high-performance polishing materials that can smooth SiC surfaces down to the atomic level in a short time.

This is a high-precision, high-resolution 3D printing solution that combines 3D printing technology with the unique Ceramics sintering technology developed by Mitsui Kinzoku .

We manufacture and customize metal, oxide, nitride, and compound sputtering targets, including Cu, Al, Ti, Mo, In₂O₃, ZnO, SnO₂, AZO, TCO, SiN, and AlN, and propose optimal materials for displays, semiconductors, solar cells, and other PVD applications.

A next-generation ITO target that suppresses particle generation and helps stabilize the deposition process.

High-quality targets ideal for cylindrical sputtering systems that enable high-efficiency, uniform deposition.

We provide oxide semiconductor targets, with a focus on high-performance IGZO targets.

Our proprietary technologies achieve high density and provide high-quality ITO targets with reduced nodule formation.

Liquid raw materials in which various metal compounds are dissolved. Unlike dispersions, no particulates are present.