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Thermal management materials

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  • Electronic components, semiconductors, and ICs (integrated circuits)
  • Thermal management materials
MicroThin Series - Ultra-Thin Carrier-Supported Copper Foil

The MicroThin Series features 1.5–5 μm ultra-thin copper foil supported by a carrier foil. It is designed for high-density, fine-line circuitry formation in advanced electronic applications
Electro-deposited Copper Foil for Flexible Printed Circuit Boards

Advanced crystalize grain structure control technology delivers outstanding flexibility and durability, maintaining excellent performance even after repeated bending.
Electro-deposited Copper Foil for High-Speed Signal Transmission​

Advanced smooth surface treatment technology minimizes transmission loss in high-frequency signal applications to the greatest extent possible.
Negative Thermal Expansion Powder

Mitsui Kinzoku's negative combines high contraction efficiency, flexible customization options, and a wide operating temperature range, delivering optimal performance across a broad range of applications.

Copper powder

Copper powder has excellent electrical and thermal conductivity and is one of the materials that underpin a wide range of industries, including those that use electronic materials and metallurgical powders.

Oxides and rare earth compounds

We offer a wide range of rare earth oxides and rare earth compounds.

3D Printing

This is a high-precision, high-resolution 3D printing solution that combines 3D printing technology with the unique Ceramics sintering technology developed by Mitsui Kinzoku .

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