背景画像: 電子部品・半導体・IC（集積回路）

Conductive pastes and bonding materials

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  • Electronic components, semiconductors, and ICs (integrated circuits)
  • Conductive pastes and bonding materials
Negative Thermal Expansion Powder

Mitsui Kinzoku's negative combines high contraction efficiency, flexible customization options, and a wide operating temperature range, delivering optimal performance across a broad range of applications.

Solder Powder

This is a fine powder of an alloy made from a base of tin with added silver, copper, bismuth, and other elements. It is the most common bonding material used to join electronic components electrically and mechanically.

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