Antennas

Advanced crystalize grain structure control technology delivers outstanding flexibility and durability, maintaining excellent performance even after repeated bending.

Advanced smooth surface treatment technology minimizes transmission loss in high-frequency signal applications to the greatest extent possible.

The MicroThin Series features 1.5–5 μm ultra-thin copper foil supported by a carrier foil. It is designed for high-density, fine-line circuitry formation in advanced electronic applications

High-performance materials for embedded capacitors, supporting improved electrical performance and higher circuit integration.

Copper powder has excellent electrical and thermal conductivity and is one of the materials that underpin a wide range of industries, including those that use electronic materials and metallurgical powders.

This is a high-performance functional material in which copper powder is coated with silver.

Thanks to its low apparent density resulting from its unique dendrite structure, it achieves high conductivity and low cost even in small quantities.