背景画像: 電子部品・半導体・IC（集積回路）

Polyimide (PI)

View:

  • Electronic components, semiconductors, and ICs (integrated circuits)
  • Polyimide (PI)
MicroThin Series - Ultra-Thin Carrier-Supported Copper Foil

The MicroThin Series features 1.5–5 μm ultra-thin copper foil supported by a carrier foil. It is designed for high-density, fine-line circuitry formation in advanced electronic applications
Electro-deposited Copper Foil for Flexible Printed Circuit Boards

Advanced crystalize grain structure control technology delivers outstanding flexibility and durability, maintaining excellent performance even after repeated bending.
Electro-deposited Copper Foil for High-Speed Signal Transmission​

Advanced smooth surface treatment technology minimizes transmission loss in high-frequency signal applications to the greatest extent possible.
Negative Thermal Expansion Powder

Mitsui Kinzoku's negative combines high contraction efficiency, flexible customization options, and a wide operating temperature range, delivering optimal performance across a broad range of applications.

View Other Electronic components, semiconductors, and ICs (integrated circuits) Applications

Application

Product Search

View All Products
Back to top