summary
Combines Ultra-Thin Construction with Superior Handling
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Ultra-thin copper foil being peeled off
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MicroThin™ Illustration
The MicroThin™ Series features an ultra-thin 1.5–5 μm copper foil supported by an 18 μm or 12 μm carrier foil through a release layer. After lamination onto a resin substrate, the carrier foil is easily removed, enabling the fabrication of high-density, fine-line circuit boards while maintaining excellent processability and handling efficiency.
Features and Strengths
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Over 95% global market share in carrier-supported ultra-thin copper foil
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High-volume production capability for MicroThin™ copper foil
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Precise peel strength control
Applications
Semiconductor package substrates with fine-line circuitry
Smartphone motherboard circuit fabrication
Product Line Up
MicroThin™ is a carrier-supported ultra-thin copper foil designed for the MSAP (Modified Semi-Additive Process). It combines excellent handling with ultra-thin construction, making it ideal for high-density, fine-line circuit fabrication.
| Variations | Surface roughness [μm]. |
Target L/S by MSAP |
Thickness [μm]. | ||||
|---|---|---|---|---|---|---|---|
| 1.5 | 2 | 3 | 5 | ||||
| Standard | MT18SD-H | Rz 3.0 | 30/30μm | - | - | period | period |
| Low Profile | MT18Ex | Rz 2.0 | 25/25μm | period | period | period | period |
| Very Low Profile | MT18FL | Rz 1.3 | 15/15μm | period | period | period | ~ |
| Special Low Profile | MT18GN | Rz 0.9 | 10/10μm | period | period | period | - |
Contact us to learn more about MicroThin™ and its applications, success stories, and technical capabilities. Our experts are ready to provide the insights and support you need to identify the best solution for your requirements.
