Technology Introduction

Ultra-thin copper foil of 5 µm or less with a carrier copper foil that can be peeled off after lamination to a substrate. Ultra-thin copper foil is mainly used as a seed layer in the MSAP process.

This copper foil has an extremely smooth surface by controlling the shape of copper deposition. It contributes to low transmission loss in high-speed and high-frequency board applications.

This copper foil has low stiffness and high flexibility by controlling the copper crystal size. Low roughness products are also available for high-frequency FPC applications.

A capacitor material that reduces power supply noise, FaradFlex™ can be used to reduce board size and improve power supply to ICs in addition to reducing noise.