Sheet capacitor material with a thin, high-capacity dielectric layer between two copper foils for board embedded capacitors
The FaradFlex™ series is a sheet capacitor material consisting of two copper foils sandwiching an embedded dielectric layer filled with high-density dielectric filler. The use of FaradFlex™ eliminates the need for wiring, which in addition to reducing noise, enables smaller board size and improved power supply to ICs. The FaradFlex™ series is used for signal noise reduction in high-speed transmission boards and small microphones in IT equipment, and its applications are expanding as the speed and capacity of signals increase.
The FaradFlex™ structure
Conventional wiring image
Wiring image using FaradFlex™.
Noise reduction simulation
Chip capacitor
FaradFlex™
Conditions: 18-layer substrate (7.5 x 9.5 inches), 600µm board thickness, 35µm copper foil, 3.3V, 1 to 1000MHz (1MHz steps)
Technology & Features
In-house development of resins
In-house coating available
Filler dispersion/ filling technology
Resin mixing tester
Test coating equipment
FaradFlex™ cross-sectional electron micrograph
Examples to use
For high-speed boards: ・Thickness reduction between power and ground layers ・Decoupling capacitor instead of noise-rejecting ・Noise reduction
Substrate for high-speed transmission
MEMS microphones in smartphones and wireless earphones