Substrate-embedded capacitor materials
FaradFlex™ series
Sheet capacitor material with a thin, high-capacity
dielectric layer between two copper foils
for board embedded capacitors
The FaradFlex™ series is a sheet capacitor material consisting of two copper foils sandwiching an embedded dielectric layer filled with high-density dielectric filler.
The use of FaradFlex™ eliminates the need for wiring, which in addition to reducing noise, enables smaller board size and improved power supply to ICs.
The FaradFlex™ series is used for signal noise reduction in high-speed transmission boards and small microphones in IT equipment, and its applications are expanding as the speed and capacity of signals increase.
The use of FaradFlex™ eliminates the need for wiring, which in addition to reducing noise, enables smaller board size and improved power supply to ICs.
The FaradFlex™ series is used for signal noise reduction in high-speed transmission boards and small microphones in IT equipment, and its applications are expanding as the speed and capacity of signals increase.
The FaradFlex™ structure
Conventional wiring image
Wiring image using FaradFlex™.
Noise reduction simulation
Chip capacitor
FaradFlex™
Conditions: 18-layer substrate (7.5 x 9.5 inches), 600µm board thickness, 35µm copper foil, 3.3V, 1 to 1000MHz (1MHz steps)
Technology & Features
Resin mixing tester
Test coating equipment
FaradFlex™ cross-sectional
electron micrograph
electron micrograph
Examples to use
For high-speed boards：
・Thickness reduction between power and ground layers
・Decoupling capacitor instead of noise-rejecting
・Noise reduction
・Thickness reduction between power and ground layers
・Decoupling capacitor instead of noise-rejecting
・Noise reduction
Substrate for high-speed transmission
MEMS microphones in smartphones and wireless earphones
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Copper Foil Division Technical Handbook!
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