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（英語）技術紹介

（英語）高屈曲箔Super HTE™シリーズ

Highly Flexible Foil
Super HTE™ series

Ductility to withstand repeated bending and creasing by controlling the size of crystals

The Super HTE™ series is a soft, crack-resistant copper foil in which the size of copper deposition is controlled to form giant copper crystals to minimize the crystal interface, which is the starting point of cracking and a factor in hardness.
The Super HTE™ series is used in flexible printed circuit boards (FPC), which are printed circuit boards that can be bent.

Copper foil cross section

MIT test with copper foil applied to FPC.

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Crystal size control

General copper foil

・For forming circuits on flexible boards

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The Super HTE™ series is a soft, crack-resistant copper foil in which the size of copper precipitation is controlled to form giant copper crystals to minimize the crystal interface, which is the origin of cracking and a factor in hardness.

Highly Flexible Foil
Super HTE™ series

Ductility to withstand repeated bending and creasing by controlling the size of crystals

Technology & Features

Examples to use

Contact Us

Highly Flexible FoilSuper HTE™ series

Ductility to withstand repeated bending and creasing by controlling the size of crystals

Technology & Features

Examples to use

Contact Us

Highly Flexible Foil
Super HTE™ series