Ductility to withstand repeated bending and creasing by controlling the size of crystals
The Super HTE™ series is a soft, crack-resistant copper foil in which the size of copper deposition is controlled to form giant copper crystals to minimize the crystal interface, which is the starting point of cracking and a factor in hardness. The Super HTE™ series is used in flexible printed circuit boards (FPC), which are printed circuit boards that can be bent.