With peelable carrier foil for both thinness and ease of handling
The MicroThin™ series is a two-layer copper foil consisting of a firm 18µm carrier foil and an ultra-thin copper foil of 5µm or less attached with a release. By peeling off only the carrier foil after laminating the entire carrier foil to a resin film or the like, it is possible to use the ultra-thin copper foil while maintaining handling properties.
General copper foil
MicroThin™
MicroThin™
Technology & Features
Over 95% world's market share as thin copper foil with carrier foil.
High thin foil productivity
Release Strength Control
The release strength (adhesion strength between thin copper foil and carrier foil) is controlled to be uniform everywhere on the huge copper foil roll, which is more than one meter wide and several thousand meters long.
Carrier foil/thin copper foil interface release strength distribution
examples showing the use
・For forming fine circuits on semiconductor package boards ・For forming circuits for smartphone motherboards