Ultra-Thin Copper Foil Technology That Makes the "Unmanageable" Possible
This technology significantly expands the range of applications for ultra-thin Copper Foil , which were previously considered “too thin to handle” or “unsuitable for manufacturing processes.”
This serves as a foundational technology that accelerates technical evaluation during the prototyping phase through the utilization of existing equipment and improvements in yield.
Technology and Features
Combines maneuverability with a slim profile
The ultra-thin carrier-mounted Copper Foil integrates the carrier Copper Foil and the ultra-thin Copper Foil , ensuring high mechanical and dimensional stability even for thin foils measuring just a few micrometers.
During processing, the carrier Copper Foil supports the ultra-thin Copper Foil , enabling a wide range of processes such as microfabrication, surface treatment, and lamination. A major advantage of this final process is that it allows for the selective peeling of only the Copper Foil , thereby achieving both ease of handling and thinness.
Examples of Use
Copper Foil , an ultra-thin film on a carrier, is used as an intermediate material for applications such as microstructure formation and composite material fabrication, and in final products, it functions as a functional layer—either as Copper Foil on its own or integrated with other materials. It is expected to be applied to material design that is not limited to specific applications, particularly in the aerospace sector, where there is a demand for lighter weight and higher performance.
Development Case Studies
By combining our proprietary peelable copper foil technology with a hot stamping process, Mitsui Kinzoku has developed a liquid-waste-free metal patterning process.
This dry-process technology enables metal patterning on paper-based substrates, helping reduce plastic usage and supporting more sustainable manufacturing.
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