Copper Patterning Using Hot Stamping A Copper Patterning Process That Does Not Discharge Waste Liquid

Seeking Co-Creation Partners

Partners We Are Seeking

We are seeking companies that have product technologies such as the following and are interested in developing environmentally friendly products:

  • RFID tags, labels, and inlays
  • Sheet heaters and film heaters
  • Other products, including simple signal lines and simple antennas

What We Can Offer

We can provide the following technologies:

  • Copper foil for hot stamping
  • Research and development of copper foil tailored to the applications required by our partners

Market Challenges We Are Addressing

Metal patterns made from copper, aluminum, and other metals are used in RFID tags, film heaters, antennas, and other devices. Many metal patterning processes use photolithography, a technology based on photographic development, and require multiple chemical solutions.

Waste liquid generated during these processes must undergo complex treatment before discharge from the perspectives of environmental protection and safety. However, this treatment also requires a large amount of energy, creating a need to reduce CO2 emissions associated with electricity consumption.

Our Proposed Solution

We propose a metal patterning process that does not discharge waste liquid by combining our peelable copper foil technology with a process known as hot stamping.

What Is Hot Stamping?

Hot stamping, also known as foil stamping, is a technology that transfers a desired design by applying heat and pressure to a special foil film using a raised die. It has long been widely used in Japan and overseas as a decorative technique for book covers, posters, product labels, and other items. Over time, its application areas have expanded, and it is now also used for decorating automotive interiors and exteriors, home appliances, and electronic devices. The special foil film consists of multiple layers. It is designed so that, when heat and pressure are applied by the raised die, the foil adheres to the target substrate and can be released from the carrier.

Principle of Hot Stamping

Typical Foil Film Structure

Advantages of Hot Stamping

Process Simplification

No pre- or post-processing steps such as masking or drying are required.

Compact Equipment

Depending on the equipment, desktop models are also available.

Low Environmental Impact

No chemicals, solvents, or liquid solutions are required.

Our Proposed Copper Foil Hot Stamping Process

Based on our peelable copper foil technology, we produced a prototype copper foil for hot stamping and transferred it onto a PET substrate using a hand-press-type hot stamping machine.

This process is expected to enable copper patterning without the use of any chemical solutions.

Because this dry process can also be used for patterning on paper substrates, it is also expected to contribute to reducing plastic usage.

Principle of Copper Foil Hot Stamping

Copper foil and the substrate are pressed together using a heated raised die.

As the adhesive layer on the substrate melts and cures, the copper foil is transferred onto the substrate, enabling pattern formation

Hand press

Heater patterns created by hot stamping

Video of hot stamping using a hand press

Contact

Feel free to reach out

When you think, "Can this be done?",
feel free to reach out.

Learn more about the Copper Foil Division.
Copper Foil Division Technical Handbook!

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