Mitsui Kinzoku Copper Foil Division is looking for partners to create the next generation of products together.
We believe the innovations we pursue today will shape the next decade.
At Mitsui Kinzoku Copper Foil Division, we are looking for partners to build the future together using our world-class copper foil technologies. By collaborating across industries, we can create innovative solutions that shape the next 10 years and beyond.
"Beyon-Dou" combines "Beyond" with "Dou" (銅), the Japanese word for copper. The name symbolizes our ambition to take copper foil beyond its conventional applications and unlock new possibilities through innovation.
Capabilities of the Copper Foil Division
“Thin Foils”
As metal foils become thinner, they become more fragile and difficult to handle.
To overcome this challenge, we have developed proprietary carrier foil technologies that enable ultra-thin copper foils to be handled and processed efficiently. We produce copper foils ranging from 1.5 μm to 5 μm in thickness and continue pushing the limits by developing even thinner foils.
(We are the world's largest producer of electrodeposited copper foil 5 μm or less in thickness, with more than 95% of the global market.)
*Based on internal market research.
*1 μm = 1/1,000,000 m
“Bondable Foils”
We develop proprietary adhesives and provide copper foils coated with these adhesives.
These foils can be bonded to glass and resin films, opening up new application possibilities.
“Perforated Foils”
Perforated metal foils are typically produced by punching or drilling holes after manufacturing. Our deposition technology allows perforations to be formed during manufacturing.
This reduces manufacturing steps, minimizes waste, and allows precise control of hole size and hole density.
What is copper foil?
Copper foil is a thin sheet of copper with a thickness in microns (µ).
Imagine a copper version of aluminum foil or gold leaf. A sheet made of thin copper is called copper foil.
Copper foil is used in a variety of fields, including electronic devices such as smartphones and computers, home appliances, automobiles, and construction, and is one of the important materials that support your daily life.
*µm = 1/1,000,000 m
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What Can the Copper Foil Division’s Materials Be Used For? Here Are Some Possible Applications of Our Materials
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Example: Peelable Foils × Lightweight
Using our proprietary peelable carrier technology, ultra-thin copper foil can be laminated onto a variety of materials, opening new possibilities for lightweight applications in aerospace and other industries with weight restrictions.
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Example: Adhesive Foils × Conductivity
Our adhesive-coated copper foil technology could enable transparent antennas for 5G and future wireless communications by laminating copper foil to transparent films that can be mounted on building or vehicle glass.
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Example: Perforated Foils × Flow Control
Perforated copper foil can function as a filter for liquids and gases. By precisely controlling hole size, hole density, and layer configuration, flow characteristics can be tailored to each application.
Meet the Team
IIDA Hiroto is in charge of developing new markets. After working at several other companies, he joined the company in 2006. He graduated from the Faculty of Engineering at Yokohama National University. Since joining the company, he has engaged in customer technical contact and market research. “Ask me anything!”
NAKAJIMA Daisuke of the Development Department joined the company in 2007 after graduating from the Graduate School of Science and Technology at Tokyo University of Science. He took up his current role after engaging in basic research and manufacturing management. “No Challenge, No Life!”
KOBAYAKAWA Hiroki is in charge of developing new markets. He engaged in materials development and marketing at several companies and joined the company in 2025. He graduated from the Faculty of Engineering at Nagoya Institute of Technology. “Let's enjoy creating new value together!”
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