Copper Foil Technology Supporting New Applications

Based on the structural and process technologies for copper foil that Mitsui Mining & Smelting has cultivated over the years, we introduce technologies that support the development of new applications.

Peelable Foil × Weight Reduction

By precisely controlling the peelability of ultra-thin copper foil, we have achieved functionalities suitable for lightweight designs

Adhesive foil × Conductive material

Bonds through surface structure to provide stable conductivity

Perforated Foil × Structural Control

Controlling flow and reactions using a random pore structure

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Learn more about the Copper Foil Division.
Copper Foil Division Technical Handbook!

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