Our electrolytic copper foil products are through electrolytic copper plating. We can produce perforated copper foil using a process nearly identical to that of these products.
Punching, laser cutting, or photo-etching are typically required to create holes in copper foil, but our developed perforated copper foil eliminates the need for such post-processing.
Therefore, we provide thin perforated copper foil with a high aperture ratio, free from large protrusions such as burrs or copper splinters.

Since no post-processing is required and the likelihood of burrs or copper splatter causing protrusions is low, the risk of short circuits due to copper foil contact or dendrite formation is expected to be low when a laminated structure is necessary.
The ability to set narrower distances between copper foils is expected to contribute to the miniaturization of devices.

Metals and ceramics containing internal pores are commonly used as high-specific-surface-area materials.
They are often made by sintering fine particles or fibers, which makes them inflexible and prone to powder shedding. However, our proprietary product is thin and flexible, allowing it to be used like a “porous body” without powder shedding.