Engineered Powders Division

Exhibited at COMNEXT 1st [Next Generation] Communications Technology & Solutions Expo

Published:
Updated:
We will exhibit at COMNEXT Exhibition to be held at Tokyo Big Sight on June 28-30, 2023.

Cu-based wiring material that can be sintered at low temperatures and in air
New Light Scattering Material Particles with UV Transmission
UV-resistant black powder for NIR-transparent films



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