Tuesday-Wednesday, February 24-26, 2026
Exhibit at DesignCon, Santa Clara, CA

Event Summary

イベント02
Our team is heading to DesignCon 2026 in Santa Clara to engage with Silicon Valley’s premier Hi-Tech design engineers. We look forward to demonstrating how FaradFlex, MT, and VSP copper optimize next-generation PCBs in the very heart of the world’s highest concentration of electronic designers.

Date:Tuesday-Wednesday, February 24-26, 2026
Location: Santa Clara Convention Center
URL: DesignCon

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Copper Foil Division Technical Handbook!
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