Tuesday-Wednesday, February 24-26, 2026 Exhibit at DesignCon, Santa Clara, CA
Event Summary
Our team is heading to DesignCon 2026 in Santa Clara to engage with Silicon Valley’s premier Hi-Tech design engineers. We look forward to demonstrating how FaradFlex, MT, and VSP copper optimize next-generation PCBs in the very heart of the world’s highest concentration of electronic designers.
Date:Tuesday-Wednesday, February 24-26, 2026 Location: Santa Clara Convention Center URL: DesignCon
Contact Us
Learn more about Copper Foil Division Technical Handbook!