Leading Company
of 3D Printing Copper

High Conductivity ×
Printability
Mitsui Kinzoku, a leading Japanese inorganic material manufacturer,
provides spherical copper powders made by gas atomize that are ideal for use with various 3D printers.
about

Cost Effective, High Performance for Aerospace and Defence

The MA-CCR25H, a next-generation copper material surpassing GRCop-42, is specifically designed for the aerospace industry. This material is ideal for rocket parts, particularly rocket engines and chambers. The MA-CCR25H demonstrates comparable strength and thermal conductivity to commercial copper alloys while exhibiting lower manufacturing costs. Users can choose the most suitable annealing profiles based on their designs.

Advantage of MA-CCR25H compared to Commercial Copper Alloys

Material Post Heating Performance of Printed Parts     Manufacturing Cost Related Factors 
Tensile Strength 
at R.T. /MPa
Tensile Strength 
at 400℃/MPa 
Thermal Conductivity
 W/mK
Material Cost Printing Productivity
cc/h
Vertical Horizontal Vertical Horizontal 

CuCr
MA-CCR25H

Anneal at 600℃  404 482 187 222 298 $
Inexpensive
✓✓
High
Anneal at 650℃ 356 393 169 178 330
Anneal at 700℃ 282 344 139 150 343
GRCop-42 HIP 355※1 180※1  270※1 $$$
Expensive
✓✓
High 
HIP at 954℃ 389※2 - 323※2
CuCrZr Anneal at 950℃,
water quenching,
aging 600℃ 
 295※3  340※3  -  - 324※4 $
Inexpensive

Low
※1 NASA
※2 Velo3D
※3 Nikon SLM Solutions
※4 Sandvik
about_02

Enhance Cooling Efficiency with Liquid Cooling Solutions for AI Data Centers

Mitsui's additive manufacturing copper solution is a game-changer in thermal management, delivering superior cooling performance ideal for cold plates that provide direct to chip cooling in AI data centers.
It not only ensures a consistently comfortable operating condition but also reduces energy consumption, leading to significant cost savings.

Comparison Chart for Thermal Management Applications

Material Company Laser Output Relative Density Conductivity Resolution
Thermal
Conductivity
Electrical
Conductivity
Minimal 
Wall thickness
W % W/mK % IACS μm
CuCr
MA-CCR25L
Mitsui Kinzoku 400 99.5 377 95 200※2
CuCr
MA-CCR25H
Mitsui Kinzoku 400 99.5 349 93 below 150※2
CuCrZr EOS※1 1000 99 - 80-85 -
Sandvik※1 - 98 324 80-90 -
Pure Copper EOS※1 400 95 - 90 -
EOS※1 1000 99.6 - 100.7 700
※1 Each Company’s website
※2 Mitsui’s internal test result with EOS M290

Cold Plate

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Heat Exchanger Application

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DfAM Cold Plate performance

Design for additive manufacturing (DfAM) CuCr cold plate can reduce pressure drop by 90% and thermal resistance by over 20%
Cold Plate Performance
Cold Plate Performance

Mitsui's Copper Powder Lineups for Additive Manufacturing

Mitsui is a leading metal powder manufacturer. We provide spherical copper powders made by gas atomize for a variety of 3D printing processes such as Laser Powder Bed Fusion(L-PBF), binder jetting, DLP and cold spray. Please contact us for details.

Material

Material
Name

AM

Process

Particle Size (µm) ※

Advantage

Example Applications

D10

D50 D90

Cold Plate

Induction Coil

Aerospace

CuCr

MA-CCR25L

L-PBF

13 30 51 High Conductivity
High Resolution
Consistent Quality

✓✓

 

CuCr

MA-CCR25H

L-PBF

17 32 53 High Strength
High Resolution
Consistent Quality

✓✓

 ✓
Cu MA-HC-LOP L-PBF,

Cold Spray

16 28 45

High Purity
Consistent Quality

 
Cu MA-HC-3

Binder Jetting,
DLP

6 15 26    
※These numbers are measurement example and do not specify the powder characteristics.
✓✓: Highly recommend
✓: Recommend

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