Leading Company of AM Copper
High Conductivity ×
Printability
Printability
A PERFECT MANAGER IN ANY THERMAL APPLICATION
Mitsui Kinzoku, a leading Japanese inorganic material manufacturer, introduces an innovative solution for Laser Powder Bed Fusion (L-PBF) with its copper chromium alloys. Mitsui's AM copper solution emerges as a game-changer in thermal management, designed to deliver superior cooling performance. It not only ensures a consistently comfortable operating condition but also reduces energy consumption, leading to significant cost savings.
Comparison Chart for Thermal Management Applications
| Material | Company | Laser Output | Relative Density | Conductivity | Resolution | ||
| Thermal Conductivity |
Electrical Conductivity |
Minimal Wall thickness |
|||||
| W | % | W/m・K | % IACS | μm | |||
| MA-CCR25L CuCr |
Mitsui Kinzoku | 400 | 99.5 | 377 | 95 | 200※2 | |
| MA-CCR25H2 CuCr |
Mitsui Kinzoku | 400 | 99.5 | 349 | 93 | below 150※2 | |
| CuCrZr | EOS※1 | 1000 | 99 | - | 80-85 | - | |
| 3T※1 | - | 99 | 300< | 80-90 | - | ||
| Pure Copper | EOS※1 | 400 | 95 | - | 90 | - | |
| EOS※１ | 1000 | 99.6 | - | 100.7 | 700 | ||
※1 Each Company’s website
※2 Mitsui’s internal test result with EOS M290
※2 Mitsui’s internal test result with EOS M290
Cold Plate
Heat Exchanger Application
Cold Plate Performance
DfAM CuCr can reduce pressure drop by 90% and thermal resistance by over 20%
Recycle Test: MA-CCR25L
Printer: EOS M290, new powder is added into a chamber at ambient atmosphere once a test is done
FREE SAMPLES NOW
A TRUSTED PARTNER IN YOUR AEROSPACE BUSINESS
The MA-CCR25H2, a next-generation copper material surpassing GRCop42, is specifically designed for the aerospace industry. MA-CCR25H2 demonstrates comparable strength and thermal conductivity to commercial copper alloys while exhibiting lower manufacturing costs. Users can choose the most suitable annealing profiles based on their designs.
Advantage of MA-CCR25H2 compared to Commercial Copper Alloys
| Material | Post Heating | Performance of Printed Parts | Manufacturing Cost related factors | |||||
| Tensile Strength at R.T. /MPa |
Tensile Strength at 400℃/MPa |
Thermal Conductivity /W/mk |
Material Cost | Printing Productivity | ||||
| Vertical | Horizontal | Vertical | Horizontal | |||||
| CuCr MA-CCR25 H2 |
Anneal at 600℃ | 404 | 482 | 187 | 222 | 298 | $ Inexpensive |
✓✓ High |
| Anneal at 650℃ | 356 | 393 | 169 | 178 | 330 | |||
| Anneal at 700℃ | 282 | 344 | 139 | 150 | 343 | |||
| GRCop-42 | HIP | 355※1 | 180※1 | 270※1 | $$$ Expensive |
✓✓ High |
||
| HIP at 954℃ | 389※2 | - | 323※2 | |||||
| CuCrZr | Anneal at 430℃※3 | 340※3 | - | - | 300※4 | $ Expensive |
✓ Low |
|
※1:NASA
※2 VElo3D
※3:EOS
※4 3T
※2 VElo3D
※3:EOS
※4 3T
Pure Copper Lineups for Additive Manufacturing
We can offer highly pure copper grades for a variety of processes such as L-PBF, binder jetting, DLP and cold spraying.
| Product Number |
Atomization Process |
AM Process |
Powder Properties※ | |||||
| D10 | D50 | D90 | Purity | O2 | ||||
| mm | mm | mm | % | % | ||||
| MA-HC-LOP | Gas | L-PBF, Cold Spray | 16 | 28 | 45 | >99.9 | 0.04 | |
| MA-HC3 | Gas | Biner Jetting, DLP | 6 | 15 | 26 | >99.75 | 0.11 | |
※Reference data
Download Documentation＆Free Samples
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