Leading Company of AM Copper

High Conductivity ×
Printability
about_02

A PERFECT MANAGER IN ANY THERMAL APPLICATION

Mitsui Kinzoku, a leading Japanese inorganic material manufacturer, introduces an innovative solution for Laser Powder Bed Fusion (L-PBF) with its copper chromium alloys. Mitsui's AM copper solution emerges as a game-changer in thermal management, designed to deliver superior cooling performance. It not only ensures a consistently comfortable operating condition but also reduces energy consumption, leading to significant cost savings.

Comparison Chart for Thermal Management Applications

Material Company Laser Output Relative Density Conductivity Resolution
Thermal
Conductivity
Electrical
Conductivity
Minimal 
Wall thickness
W % W/m・K % IACS μm
MA-CCR25L
CuCr
Mitsui Kinzoku 400 99.5 377 95 200※2
 MA-CCR25H2
CuCr
Mitsui Kinzoku  400  99.5  349   93  below 150※2 
CuCrZr EOS※1 1000 99 - 80-85 -
3T※1 - 99 300< 80-90 -
Pure Copper EOS※1 400 95 - 90 -
EOS※1 1000 99.6 - 100.7 700
※1 Each Company’s website
※2 Mitsui’s internal test result with EOS M290

Cold Plate

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molding_photo02

Heat Exchanger Application

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Cold Plate Performance

DfAM CuCr can reduce pressure drop by 90% and thermal resistance by over 20%
Cold Plate Performance
Cold Plate Performance

Recycle Test: MA-CCR25L

Printer: EOS M290, new powder is added into a chamber at ambient atmosphere once a test is done
about

A TRUSTED PARTNER IN YOUR AEROSPACE BUSINESS

The MA-CCR25H2, a next-generation copper material surpassing GRCop42, is specifically designed for the aerospace industry. MA-CCR25H2 demonstrates comparable strength and thermal conductivity to commercial copper alloys while exhibiting lower manufacturing costs. Users can choose the most suitable annealing profiles based on their designs.

Advantage of MA-CCR25H2 compared to Commercial Copper Alloys

Material Post Heating Performance of Printed Parts     Manufacturing Cost related factors 
Tensile Strength 
at R.T. /MPa
Tensile Strength 
at 400℃/MPa 
Thermal Conductivity
 /W/mk
Material Cost Printing Productivity
Vertical Horizontal Vertical Horizontal 
CuCr
MA-CCR25
H2
Anneal at 600℃  404 482 187 222 298 $
Inexpensive
✓✓
High
Anneal at 650℃ 356 393 169 178 330
Anneal at 700℃ 282 344 139 150 343
GRCop-42 HIP 355※1 180※1  270※1 $$$
Expensive
✓✓
High 
HIP at 954℃ 389※2 - 323※2
CuCrZr Anneal at 430℃※3  340※3   -  - 300※4 $
Expensive

Low
※1:NASA
※2 VElo3D
※3:EOS
※4 3T

Pure Copper Lineups for Additive Manufacturing

We can offer highly pure copper grades for a variety of processes such as L-PBF, binder jetting, DLP and cold spraying.

Product
Number
Atomization
Process
AM
Process
Powder Properties
D10 D50  D90 Purity O2
 mm mm mm % %
MA-HC-LOP Gas L-PBF, Cold Spray  16 28 45 >99.9 0.04
 MA-HC3 Gas Biner Jetting, DLP  6 15 26 >99.75 0.11
※Reference data

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