三井金屬3D列印銅粉

AI伺服器水冷散熱應用的材料專家

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Computex 2025 展出資訊

我們將與台灣在地合作夥伴——叡智創新科技 Rayvatek 共同參加 Computex 2025。
歡迎蒞臨參觀，我們的展位位於南港展覽館一館 1 樓 I0527a。

「熱管理」中的可靠執行者

三井金屬,有著 150年歷史的日本領頭標竿的金屬材料製造商。迎合AI時代，推出了一種適用於雷射粉床熔融（L-PBF）的創新解決方案——銅鉻合金。三井的3D列印銅的解決方案在「熱管理」方面是一個突破性進展，旨在提供卓越的冷卻性能。它不僅能確保穩定的操作環境，還能降低能耗，從而帶來顯著的成本節省。

滿足700W以上的AI伺服器散熱需求

三井金屬的3D列印銅是專門針對高負荷AI伺服器水冷應用的解決方案。能列印150μm以下的超精密設計的能力可以製造出最符合AI伺服器的冷水板，以滿足700至800W以上散熱瓦數需求。

Comparison Chart for Thermal Management Applications

Material	Company	Laser Output	Relative Density	Conductivity		Resolution
		Laser Output	Relative Density	Thermal Conductivity	Electrical Conductivity	Minimal Wall thickness
		W	%	W/m・K	% IACS	μm
MA-CCR25L CuCr	Mitsui Kinzoku	400	99.5	377	95	200※2
MA-CCR25H2 CuCr	Mitsui Kinzoku	400	99.5	349	93	below 150※2
CuCrZr	EOS※1	1000	99	-	80-85	-
CuCrZr	3T※1	-	99	300<	80-90	-
Pure Copper	EOS※1	400	95	-	90	-
Pure Copper	EOS※１	1000	99.6	-	100.7	700

※1 Each Company’s website
※2 Mitsui’s internal test result with EOS M290

Cold Plate

Heat Exchanger Application

Cold Plate Performance

DfAM CuCr can reduce pressure drop by 90% and thermal resistance by over 20%

Mitsui's Copper Powder Lineups for Additive Manufacturing

We provide spherical copper powders made by gas atomize for a variety of processes such as L-PBF, binder jetting, DLP and cold spray. Please contact us for details.

Material	Material Name	AM Process	Particle Size (µm) ※			Advantage	Example Applications
Material	Material Name	AM Process	D10	D50	D90	Advantage	Cold Plate	Induction Coil	Aerospace
CuCr	MA-CCR25L	L-PBF	13	30	51	High Conductivity High Resolution Consistent Quality	✓✓	✓
CuCr	MA-CCR25H	L-PBF	17	32	53	High Strength High Resolution Consistent Quality	✓✓	✓	✓
Cu	MA-HC-LOP	L-PBF, Cold Spray	16	28	45	High Purity Consistent Quality	✓	✓
Cu	MA-HC-3	Binder Jetting, DLP	6	15	26	High Purity Consistent Quality	✓

※These numbers are measurement example and do not specify the powder characteristics.
✓✓: Highly recommend
✓: Recommend